Particle Assembly

About us

The technical group of particle assembly started as a project-type technical group. In the group action, we catch up technical trends about wet and dry processes of high-speed coating, packing, building, deposition, stratification, and 3D assembly of nanoparticles, and distribute the trends and information for members, especially focusing on how to solve practical issues in industries and how to understand the fundamentals for developing and improving particle-assembling processes.

 Current level of technology, trend and activities in future

In the wet process, the development of precision drying technology is underway to suppress component segregation and crack formation in the thickness direction for particle laminated films with a wet thickness of 100 μm or more. In addition, ultra-thin high-speed coating technology with a wet thickness of 100 nm or less and precision lamination technology on substrates with surface irregularities or permeability are also attracting attention.

In the dry process, two- and three-dimensional lamination technique of micron to submicron particles is being developed mainly by the particle collision method, and improvement of particle adhesion probability on the substrate and control of lamination and particle packing structure are important issues. In the future, it is expected to expanded to nanoparticle stacking, and in particular, advancement of high-speed nanoparticle deposition technology by direct connection and fusion of particle synthesis and stacking processes is expected.

In addition, common issues for both processes are the control of the orientation of anisotropic particles, the development of visualization and measurement methods for the particle stacking process, and the elucidation of the stacking mechanism. In the future, it will be important to develop hybrids of dry and wet nanoparticle film formation technologies, precision multilayer film formation technology, 3D molding technology, particle stacking simulation technology and technology for utilizing materials informatics (MI).

Conductor

Coordinator The Kyushu Institute of Technology. YAMAMURA/Masato
Vice Coordinator Kanazawa University. SETO/Takafumi
Representative Organizer Murata Manufacturing Co., Ltd. NAKAO/Syuya
Vice Representative Organizer NISSHIN SEIFUN GROUP INC. NAKAMURA/Keitaro
Organizer CANON INC. KISO/Shigeo
WAGNER-HOSOKAWA MICRON LTD., KIMURA/Syoji
SAKAI CHEMICAL INDUSTRY CO.,LTD. YANO/Seiichi
NIPPN CHEMICAL INDUSTRIAL CO., LTD. TANABE/Shinji
NITTO DENKO CORPORATION. MIZUSHIMA/Hiroaki